Specification for Design of PCB Pad — Pad Size (Three)

QFP
(Pitch=0.4mm)

A=a+0.8,B=0.19mm

P=p

G1=e1-2*(0.4+a)

G2=e2-2*(0.4+a)

The pin length is 

changed from a+0.70mm to a+0.80mm, 

which is good for 

repair and printed 

pull tip handling. For 

the height of 3.8mm 

LQFP pad design 

width is used 0.23mm (stencil opening width 0.19mm)

QFP
(Pitch=0.3mm)

A=a+0.7,B=0.17mm

P=p

G1=e1-2*(0.4+a)

G2=e2-2*(0.4+a)

T=0.10mm.

Pin opening width 0.15mm

PLCC
(Pitch≧0.8mm)

A=1.8mm,B=d2+0.10mm

G1=g1-1.0mm, G2=g2-1.0mm,

P=p

BGA
Pitch=1.27mm,
Ball diameter:
Φ=0.75±0.15mm

D=0.70mm

P=1.27mm

Recommended stencil 

opening diameter is 

0.75mm

Does not represent 

the arrangement of 

the actual BGA 

bottom solder balls

BGA
Pitch=1.00mm,
Ball diameter:
Φ=0.50±0.05mm

D=0.45mm

P=1.00mm

Recommended stencil 

opening diameter is 0.50mm

Does not represent

the arrangement of 

the actual BGA 

bottom solder balls

BGA
Pitch=0.80mm,
Ball diameter:
Φ=0.45±0.05mm

D=0.35mm

P=0.80mm

Recommended stencil 

opening diameter is 0.40mm

Does not represent

the arrangement of 

the actual BGA 

bottom solder balls

BGA
Pitch=0.80mm,
Ball diameter:
Φ=0.35±0.05mm

D=0.40mm

P=0.80mm

Recommended stencil 

opening diameter is 0.40mm

Does not represent

the arrangement of 

the actual BGA 

bottom solder balls

BGA
Pitch=0.75mm,
Ball diameter:
Φ=0.45±0.05mm

D=0.3mm

P=0.75mm

Recommended stencil 

opening diameter is 0.40mm

Does not represent 

the arrangement of 

the actual BGA 

bottom solder balls

BGA
Pitch=0.75mm,
Ball diameter:
Φ=0.35±0.05mm

D=0.3mm

P=0.75mm

Recommended stencil 

opening diameter is 0.35mm

Does not represent

the arrangement of 

the actual BGA 

bottom solder balls

LGA (Ball-less BGA)
Pitch=0.65mm,
Pin diameter:
Φ=0.3±0.05mm

D=0.3mm, P=0.65mm

Recommended stencil 

1:1 opening

Does not represent 

the arrangement of 

the actual BGA 

bottom solder balls

QFN
（Pitch≧0.65mm）

A=a+0.35,B=d+0.05

P=p,W1=w1,W2=w2

G1=b1-2*(0.05+a)

G2=b2-2*(0.05+a)

Design independent pads for each pin.

Note: If the ground pad to design the thermal over-hole, it 

should be 1.0mm-1.2mm gap evenly distributed in the central 

thermal pad, over-hole should be connected to the PCB inner 

metal ground layer, over-hole diameter recommended for 0.3mm-0.33mm

It is recommended that 

the stencil pin opening 

length direction flare 

0.30mm, ground pad 

opening bridge, bridge width 0.5mm, the 

number of bridges W1/2, W2/2, take the integer.

If the pad design has 

holes, stencil openings 

to avoid holes, 

grounding pad opening area of 50% to 80% of 

the grounding pad area can be, too much tin on the pin welding has a 

certain impact

QFN
（Pitch<0.65mm）

A=a+0.3,B=d, P=p

W1=w1,W2=w2

G1=b1-2*(0.05+a)

G2=b2-2*(0.05+a)

It is recommended to 

flare 0.20mm in the 

direction of the stencil 

pin opening length, and the rest as described 

above

HDMI
(6100-150002-00)

It is recommended that

the stencil opening pin width in accordance with 0.27mm opening, pin 

length direction 

outward expansion 

0.3mm opening

HDMI
(6100-151910-00)

It is recommended that 

the stencil opening pin width in accordance with

 0.27mm opening, pin 

length direction outward expansion 0.3mm 

opening

When trial production pay attention to see if the size design is

 suitable

HDMI
(6100-151910-01)

It is recommended that

the stencil opening pin width in accordance with 0.265mm opening, pin 

length direction outward expansion 0.3mm 

opening

5400-997000-50

It is recommended that

the stencil pins be 

opened at 0.6mm in 

width and 0.4mm 

outward in the direction of the pin length.