Rogers RO4534 Microwave Printed Circuit Board

Data Sheet

• Model: Rogers RO4534 High Frequency Board

• Material: Ceramic PTFE Composite Rogers RO4534
  

• DK: 3.0±0.05

• Layer: 2Layers
• DielectricsThickness: 0.762mm(30mil)
  
• Finished Thickness: 0.86mm
  
• Material CoThickness: 0.5OZ HH/HH
  
• Finished Co Thickness: 1OZ(35μm)
  
• SurfaceTreatment: Immersion Gold
  
• Min Trace/Space: 4mil/4mil
  
• Application: PCB antenna, active antenna array for 5G, lOT pcb
  
  
  

Core Features of RO4534™ PCBs

• Excellent Electrical Performance

  Low Dielectric Constant and Dissipation Factor: RO4534™ boasts a dielectric constant (Dk) of 3.4 ± 0.08 and a dissipation factor (Df) as low as 0.0022 (2.5 GHz), significantly reducing energy loss and latency in signal transmission. This makes it particularly suitable for high-frequency applications in the millimeter-wave band, such as 5G and 24 GHz automotive radar.

  Low Passive Intermodulation (PIM): Its copper foil surface treatment optimizes the smoothness of the copper-dielectric interface, significantly reducing PIM interference. This performance excels in applications such as base station antennas, with a typical PIM value of -157 dBc.

• Good Physical and Thermal Stability
  
  High Thermal Conductivity (0.6 W/m·K): Improves heat dissipation efficiency, ensuring stable operation in high-power scenarios. – Low Coefficient of Thermal Expansion (Z-axis CTE 46 ppm/°C): Matches the thermal expansion coefficient of copper foil, reducing the risk of deformation caused by temperature changes and ensuring the reliability of multilayer boards (MLBs).
  Processing Compatibility
  RO4534™ is compatible with standard FR-4 processes, requiring no special via preparation or chemical processes, reducing manufacturing costs. It supports laser drilling and precision circuit design, meeting the stringent precision requirements of high-frequency circuits.
  
  

RO4534™ Processing and Technical Support

• Optimized Processing Parameters

  Drilling Process: Recommended drill speeds are 300-500 SFM and a feed rate of 0.002"-0.004"/rev to avoid copper foil damage at high speeds.

  Surface Treatment: Electroless or electroplating processes are used to enhance copper adhesion and ensure high-frequency signal integrity.

• Multilayer Board Design Support
  
  RO4534™ can be used with RO4000® series prepregs to achieve high-density multilayer board structures, meeting the needs of complex circuit designs.

Applications of RO4534™

• 5G Communication Base Stations and Antenna Systems 

  In 5G base stations, RO4534™ optimizes microstrip and stripline designs with its low loss and precise impedance control, reducing signal latency and improving the transmission efficiency and coverage of antenna arrays.

• Automotive Millimeter-Wave Radar 
  
  Suitable for 76-81 GHz automotive radar sensors, its high-frequency performance enables high-precision environmental perception, while its high-temperature and chemical resistance ensures long-term stable operation within the engine compartment.
• Satellite Navigation and Aerospace Equipment 
  
  In satellite receivers, RO4534™'s low dissipation factor ensures the integrity of weak signals, while its thermal and dimensional stability withstands extreme temperature and vibration environments.
• Industrial Radar and IoT Devices 
  
  For short-range industrial radars in the 60-81 GHz range, RO4534™ provides low insertion loss and stable RF performance in the millimeter-wave band, supporting high-precision detection and data transmission.