About BGA PCB
BGA PCB is a printed circuit board specifically designed for ball grid array (BGA) packaged chips. Via the array of metal solder balls on the chip’s bottom, it enables precise connection between the chip’s traditional pins and the pads on the PCB surface—effectively addressing the issues of low integration density, significant signal loss, and heat dissipation bottlenecks in electronic products.
Benefits
High-Density Integration
The solder ball array on the chip’s bottom replaces traditional pins, supporting the precision manufacturing of Fine-Pitch BGA. It meets the high integration demands of complex chips such as CPUs, GPUs, and high-end memory.
High Reliability for Harsh Operating Conditions
Fundamental performance is controlled at the source to ensure low-loss transmission of high-frequency (HF) signals and avoid signal interference.
ENIG or OSP surface finishes are applied to enhance pad oxidation resistance.
High-density blind/buried via routing is adopted to eliminate short-circuit risks.
With designs and tests for vibration resistance, high/low temperature resistance, and corrosion resistance, it maintains stable operation in complex environments.
Application
Consumer Electronics
Supports an ultra-fine solder ball pitch of 0.3mm, facilitating the upgrade of foldable screens and AI terminals.
Automotive Electronics
Empowers new energy vehicles and autonomous driving, complying with the IATF 16949 standard.
Industrial & Medical
Delivers BGA PCBs for high-precision medical detection devices, and holds ISO 13485 medical system certification.



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FR-4 stands out as one of the most versatile options. The composition of an FR-4 printed circuit board comprises a woven glass fabric reinforcement impregnated with a flame-retardant epoxy resin binder.
PCB type: Rigid PCB
Layer: Multi-layer
Base material: FR-4
Solder mask: Green
Silk screen: White
Surface treatment: HASL
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