Alumina Nitride Ceramic PCB

Data sheet

• Model: Aluminum nitride ceramic PCB
  

• Material: Ceramic PCB,Ceramic Substrate
  

• Layer: 2Layer Ceramic PCB
• Color: White
  
• Thickness: Aluminum nitride 0.635mm
  
• Copper Thickness: 1OZ(35um)
  
• Surface Treatment: Immersion Gold
  
• Gold thick: >=3U
  
• Minimum aperture: 0.8mm
  
• Process features: through hole, ceramic dam technology
  
  
  

Advantages of Aluminum Nitride Ceramic PCBs

Aluminum Nitride (AlN): High thermal conductivity and a thermal expansion coefficient close to that of silicon, making it suitable for high-speed lasers and power modules.

Advantages:

• High thermal conductivity: Aluminum nitride has a thermal conductivity significantly higher than aluminum oxide, approximately five times higher, allowing heat to dissipate quickly from electronic components.

• High electrical resistance: Aluminum nitride also has good electrical resistance.
  
• Coefficient of thermal expansion close to that of silicon: Aluminum nitride has a thermal expansion coefficient similar to that of semiconductor silicon, making it less likely for chips to fall off the substrate when used in high-power devices.
  
• High mechanical strength: Aluminum nitride has excellent mechanical properties, providing good flexural strength and impact resistance.
  
  
  

Aluminum nitride ceramic PCBs are widely used in high-power electronic components and large-scale integrated circuits due to their excellent thermal conductivity and good compatibility with semiconductors.

Application

High-power power semiconductor module, Semiconductor refrigerator, electronic heater, RF power control circuit, power hybrid circuit; Intelligent power components, High-frequency switching power supply and solid-state relay; Automotive electronics, aerospace, and military electronic components; Solar panel assembly; Telecommunications private exchange, receiving system; Laser and other industrial electronics.