Sensor IC Substrate PCB

Data Sheet

• Product Name: Sensor IC Substrate

• Material: SI1OU

• Minimum width/spacing: 35/35um
  

• Surface: Immersion Gold
  
• PCB thickness: 0.3mm
  
• Layer: 4Layers
  
• Structure: 1L-4L, 1L-2L, 3L-4L
  
• Solder mask ink: TAIYO PSR4000 AUS308
  
• Aperture: Laser hole 0.075mm, Mechanical hole 0.1mm
  
• Application: Sensor IC Substrate
  
  
  

Functions of Sensor IC Substrate

• The IC substrate acts as a bridge that connects the microchip and PCB by making electrical connections.
  

• It provides mechanical support to the chip.
  
• IC substrate plays a key function in managing heat dissipation and preventing overheating.
  
• The IC substrate protects the microchip from external environmental conditions.
  
• Their small size and light weight help designers manufacture smart devices.
  

Application

• Consumer Electronics: mobile phone processors, memory devices and digital cameras etc.

• RF Technologies: The RF technologies require high frequency and high-speed transmission, e.g. 5G.
  

• Military Industry: Drones, missiles, and aircraft etc.
  
• Automotive Electronics: navigation modules and autonomous driving systems.
  
• Medical Devices: pacemakers for heart patients and other diagnostic equipment.
  

Common Materials in IC Circuit Substrates

FR-4, ceramic, and organic laminates are widely used core materials. FR-4 is favored for its excellent mechanical and thermal properties, while ceramic substrates are used in high-frequency and high-power applications due to their excellent thermal conductivity and electrical insulation.

Copper is the primary conductive material used in IC substrates due to its high electrical conductivity and thermal properties. Gold and silver are also used in specific applications requiring high reliability and corrosion resistance.

Advanced dielectric materials such as epoxy and polyimide are used to insulate the conductive layers. These materials offer excellent electrical insulation, thermal stability, and chemical resistance.

ENIG, OSP, and immersion tin are common surface finishes that improve solderability and protect the substrate from oxidation and corrosion.

Epoxy-based soldermasks are often used to protect circuitry and prevent solder bridges during assembly.