FPGA High-Speed PCB

Data Sheet

• Model: FPGA high-speed circuit board

• Material: TG180
  
• Layer: 10Layers
  
• Finished Thickness: 1.6mm
  
• Copper Thickness: Inner/outer 1OZ
  
• Color: Blue/White
  
• Min Trace/Space: 4mil/4mil
  
• Surfacet Treatment: Hard Gold 5U
  
• Application: FPGA high-speed PCB
  

Benefits of High-Speed PCBs

• Signal Integrity Assurance: At extremely high signal transmission speeds (e.g., GHz range), ordinary PCB materials cause issues like increased signal attenuation, delay, and crosstalk due to their high dielectric constant (Dk) and dielectric loss factor (Df), severely impairing signal quality and integrity. High-speed PCB materials such as the Rogers series feature lower Dk and Df, reducing signal transmission loss, preserving sharp signal edges, and minimizing signal delay.

• Enhanced Anti-Interference Capability: Electromagnetic interference (EMI) becomes particularly pronounced at high frequencies. High-speed materials enable designers to better manage power/ground layers, create effective shielding and isolation, minimize EMI’s impact on the system, and ensure system stability.
  
• Complex System Design Requirements: High-speed PCB design often involves multi-layer boards and complex wiring, requiring special laminate structures (e.g., embedded power/ground planes, distributed capacitors, and impedance control technologies). All these demand excellent electrical performance and consistency from the board materials.
  
  
  

About the FPGA High-Speed PCB

With the rapid development of embedded hardware technology, high-speed board design has become a core skill in embedded system design. High-speed board design requires comprehensive capabilities in signal integrity, power integrity, and high-frequency routing. This is particularly challenging when combining FPGAs with high-speed memory.