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Nowadays, circuit board manufacturers are flooding the market with various prices and quality issues that we are completely unaware of. 

The copper substrate to do thermoelectric separation refers to a production process of copper substrate is a thermoelectric separation process, its substrate circuit part and thermal layer part in different line layers, the thermal layer part directly contact with the lamp bead heat dissipation part, to achieve the best heat dissipation thermal conductivity (zero thermal resistance).

If the PCB board is sealed and not unpacked, it can be used directly on the production line within 2 months of the manufacturing date.

The flying probe tester uses 4, 6, or 8 probes to perform high-voltage insulation and low-resistance continuity tests (open and short circuits of test lines) on PCB circuit boards without the need for test fixtures.

Hard gold plating, full plate gold plating, gold finger, nickel palladium gold OSP: Lower cost, good weldability, harsh storage conditions, short time, environmental protection process, good welding, smooth.

Electronic components can be seen everywhere in our life, and with the development of science and technology, the variety of electronic components has become more and more, but also began to be high-frequency, miniaturization of the direction of development.

Specification for Design of PCB Pad -- Pad Size (Three)

PCB Solder Pad Design Standard - Solder Pad Specification Size (Second)

During stackup design, it is recommended to set the center layer to the maximum copper thickness and further balance the remaining layers to match their mirrored opposite layers.

To determine the requirements of impedance control, to standardize the impedance calculation method, to formulate the guidelines of impedance test COUPON design, and to ensure that the products can meet the needs of production and customer requirements.

Deposit a thin layer of copper on the entire printed circuit board (especially on the hole wall) for subsequent hole plating, to make the hole metalized (with copper inside for conductivity), and achieve interlayer conductance.

Component type + size system + appearance size specifications named.